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共60章

免费版权信息
免费 Preface
免费 Chapter 1 Investigation on micro contact in Cu-Cu wire bondi
免费 1.1 Introduction
免费 1.2 Molecular dynamics modeling of Cu-Cu wire bonding
免费 1.3 Results and discussions
免费 1.4 Conclusions
免费 References
免费 Chapter 2 Investigation on wire bonding performance with six
免费 2.1 Introduction
免费 2.2 Moleculardynamicsmodelingofsixmaterialpairs
免费 2.3 Results and discussions
免费 2.4 Conclusions
免费 References
免费 Chapter 3 Investigation on residual stress on chip of automo
3.1 Introduction
3.2 Thermal experiment of MEMS pressure sensor
3.3 Analytic analysis of thermal stress on sensitive structu
3.4 Modeling and Simulation
3.5 Conclusions
References
Chapter 4 Investigation on thermal cycle failure of wire bon
4.1 Introduction
4.2 Thermal cycling experiments of the MEMS pressure sensor
4.3 Numerical simulation
4.4 Conclusions
References
Chapter 5 Investigation on acoustic injection on automobile
5.1 Introduction
5.2 Experimental investigation of acoustic injection
5.3 Modeling and simulation
5.4 Conclusions
References
Chapter 6 Investigation on wetting behavior of Sn droplet on
6.1 Introduction
6.2 Models and methods of different surfaces
6.3 Results and discussion
6.4 Conclusions
References
Chapter 7 Investigation on etchant spraying characteristics
7.1 Introduction
7.2 Equipment of the FPCB etching process
7.3 Numerical simulation of multi-nozzle spraying system
7.4 Results and discussions
7.5 Conclusions
References
Chapter 8 Investigation of etchant concentration distributio
8.1 Introduction
8.2 Model formulation and method of etching process
8.3 Results and discussions

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