下载掌阅APP，畅读海量书库
立即打开
[1] LONG Y, TWIEFEL J, WALLASCHEK J. A review on the mechanisms of ultrasonic wedge-wedge bonding[J]. Journal of Materials Processing Technology, 2017, 245: 241-258.
[2] ANDERSON O L, CHRISTENSEN H, ANDREATCH P. Technique for connecting electrical leads to semiconductors[J]. Journal of Applied Physics, 1957, 28: 923-923.
[3] HARMAN G. Wire bonding in microelectronics[M]. 3rd ed. New York: McGraw-Hill Education, 2010.
[4] ZHONG Z W, TEE T Y, LUAN J E. Recent advances in wire bonding, flip chip and lead-free solder for advanced microelectronics packaging[J]. Microelectronics International, 2007, 24: 18-26.
[5] ZULKIFLI M N, ABDULLAH S, OTHMAN N K, et al. Some thoughts on bondability and strength of gold wire bonding[J]. Gold Bulletin, 2012, 45: 115-125.
[6] KHOURY S L, BURKHARD D J, GALLOWAY D P, et al. A comparison of copper and gold wire bonding on integrated circuit devices[J]. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990, 13: 673-681.
[7] ZHONG Z W. Overview of wire bonding using copper wire or insulated wire[J]. Microelectronics Reliability, 2011, 51: 4-12.
[8] LONG Y, HE B, CUI W, et al. Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation[J]. Materials & Design, 2020, 192: 108718.
[9] XU H, LIU C, SILBERSCHMIDT V V, et al. A micromechanism study of thermosonic gold wire bonding on aluminum pad[J]. Journal of Applied Physics, 2010, 108: 113517.
[10] LONG Y, DENCKER F, ISAAK A, et al. Self-cleaning mechanisms in ultrasonic bonding of Al wire[J]. Journal of Materials Processing Technology, 2018, 258: 58-66.
[11] SEPPÄNEN H, KURPPA R, MERILÄINEN A, et al. Real time contact resistance measurement to determine when microwelds start to form during ultrasonic wire bonding[J]. Microelectronic Engineering, 2013, 104: 114-119.
[12] REDDY J N. Introduction to the finite element method [M]. 4th ed. New York: McGraw-Hill Education, 2019.
[13] DING Y, KIM J K, TONG P. Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy[J]. Mechanics of Materials, 2006, 38: 11-24.
[14] DING Y, KIM J K. Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature rise[J]. Microelectronics Reliability, 2008, 48: 149-157.
[15] WINCHELL V, BERG H. Enhancing ultrasonic bond development[J]. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1978, 1: 211-219.
[16] DING Y, KIM J K, ZHENG R Y. Molecular dynamic simulation on mechanism of ultrasonic wire bonding in electronic package[J]. Advanced Materials Research, 2010, 97: 2639-2643.
[17] PLIMPTON S. Fast parallel algorithms for short-range molecular dynamics[J]. Journal of Computational Physics, 1995, 117: 1-19.
[18] STUKOWSKI A. Visualization and analysis of atomistic simulation data with OVITO-the Open Visualization Tool[J]. Modelling and Simulation in Materials Science and Engineering, 2009, 18: 015012.
[19] DAW M S, BASKES M I. Semiempirical, quantum mechanical calculation of hydrogen embrittlement in metals[J]. Physical Review Letters, 1983, 50: 1285-1288.
[20] DAW M S, BASKES M I. Embedded-atom method: Derivation and application to impurities, surfaces, and other defects in metals[J]. Physical Review B, 1984, 29: 6443-6453.
[21] LI J, LU B, ZHANG Y, et al. Nanoindentation response of nanocrystalline copper via molecular dynamics: Grain-size effect[J]. Materials Chemistry and Physics, 2020, 241: 122391.
[22] LENG Y, YANG G, HU Y, et al. Computer experiments on nano-indentation: A molecular dynamics approach to the elasto-plastic contact of metal copper[J]. Journal of Materials Science, 2000, 35: 2061-2067.
[23] ABDESLAM S. Influence of silver inclusions on the mechanical behavior of Cu-Ag nanocomposite during nanoindentation: Molecular dynamics study[J]. Results in Physics, 2019, 15: 102672.
[24] SHAO W, SHI Z, RAO L, et al. Molecular dynamics simulation on deformation behavior of DLC films based on γ-Fe/CrN matrix[J]. Materials Today Communications, 2020, 25: 101460.
[25] ZHAO P, ZHANG Q, GUO Y, et al. Atomic simulation of crystal orientation effect on coating surface generation mechanisms in cold spray[J]. Computational Materials Science, 2020, 184: 109859.
[26] LANDMAN U, LUEDTKE W D, BURNHAM N A, et al. Atomistic mechanisms and dynamics of adhesion, nanoindentation, and fracture[J]. Science, 1990, 248: 454-461.