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［1］ 李德胜．MEMS技术及其应用．哈尔滨：哈尔滨工业大学出版社，2002.
［2］ 黄庆安．硅微机械加工技术．北京：科学出版社，1996.
［3］ Petersen K E. Silicon as a Mechanical Material. Proc. IEEE, 1982, 70. 420～457.
［4］ 苑伟政．微机械与微细加工技术．西安：西北工业大学出版社，2000.
［5］ ［美］沃森J L. 薄膜加工工艺．刘光治，译．北京：机械工业出版社，1987.
［6］ 田文超．微机电系统（MEMS）原理、设计和分析．西安：西安电子科技大学出版社，2009.
［7］ 丁衡高．微机电系统的科学研究和发展．清华大学学报，1997, 37(9): 1～5.
［8］ Khuri-Yakub B T, Smits J G. Reactive magnetron sputtering of ZnO. J. Appl. Phys. Appl. 1981, 52(7).
［9］ Motamedi M E, Staples E J, Wise J. Characterization of ZnO/Si SAW transducers and resonators using complex return loss measurements. Pro. Sonics and Ultrasonic Symp, 1981.
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［11］ Sankur H, Motamedi M E. Properties of ZnO deposited by laser assisted evaporation, Proc. Sonics and Ultrasonics Symp., 1983: 316.
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［14］ Takayama R, et al. Preparation and characteristics of pyroelectric infrared sensor made of c-axis oriented La-modified PbYiO 3 thin films, Appl. Phys., 1987, 61: 411.
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［16］ Ogawa T, Senda S, Kasanami T. Preparation of ferroelectric thin films by RF sputtering, Jpn. J. Appl. Phys., 1989, 28: 11～14.
［17］ Odada M, et al. Preparation of c-axis printed PbTiO 3 thin film by MOCVD under reduced pressure. Jpn. J. Appl. Phys., 1989, 28: 1030.
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［19］ Yi, G, Wu Z, Sayer M. Preparation of PZT thin film by sol-gel processing: clectrical, optical, and electro-optic properties, I. Appl. Phys., 1989, 64(5).
［20］ Chen P, et al. Integrated silicon microbeam PI-FET accelerometer, IEEE Trans. Electron. Devices., 1982, ED-29(1).